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No. STSE-CC3066A SPECIFICATIONS FOR NICHIA CHIP TYPE BLUE LED MODEL : NSCB505CT NICHIA CORPORATION -0- Nichia STSE-CC3066A Symbol IF IFP IR PD Topr Tstg Tsld Absolute Maximum Rating 30 100 85 120 -40 ~ + 85 -40 ~ +100 Reflow Soldering : 260C Hand Soldering : 350C (Ta=25C) Unit mA mA mA mW C C for 10sec. for 3sec. IFP Conditions : Pulse Width < 10msec. and Duty < 1/10 = = (2) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Rank U Iv Luminous Intensity Rank T Iv Rank S Iv Condition IF=20[mA] IF=20[mA] IF=20[mA] IF=20[mA] Min. 213 150 104 Typ. 3.6 252 178 126 (Ta=25C) Max. Unit 4.0 V 300 mcd 213 mcd 150 mcd ! Luminous Intensity Measurement allowance is 10%. Color Rank x y 0.11 0.04 (IF=20mA,Ta=25C) Rank W 0.11 0.15 0.15 0.10 0.10 0.04 ! Color Coordinates Measurement allowance is 0.01. ! One delivery will include up to one color rank and three luminous intensity ranks of the products. The quantity-ratio of the ranks is decided by Nichia. 2.TYPICAL INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS Please refer to figure's page. 3.OUTLINE DIMENSIONS AND MATERIALS Please refer to figure's page. Material as follows ; Package : Encapsulating Resin : Electrodes : Heat-Resistant Polymer Epoxy Resin (with Diffused) Ag Plating Copper Alloy -1- Nichia STSE-CC3066A 4.PACKAGING * The LEDs are packed in cardboard boxes after taping. Please refer to figure's page. The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity * In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. * The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. * The boxes are not water resistant and therefore must be kept away from water and moisture. * When the LEDs are transported, we recommend that you use the same packing method as Nichia. 5.LOT NUMBER The first six digits number shows lot number. The lot number is composed of the following characters; "#$$$$ - !% " - Year ( 2 for 2002, 3 for 2003 ) # - Month ( 1 for Jan., 9 for Sep., A for Oct., $$$$ - Nichia's Product Number ! - Ranking by Color Coordinates % - Ranking by Luminous Intensity B for Nov. ) -2- Nichia STSE-CC3066A 6.RELIABILITY (1) TEST ITEMS AND RESULTS Test Item Resistance to Soldering Heat (Reflow Soldering) Solderability (Reflow Soldering) Thermal Shock Standard Test Method JEITA ED-4701 300 301 JEITA ED-4701 300 303 JEITA ED-4701 300 307 JEITA ED-4701 100 105 JEITA ED-4701 200 203 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 Test Conditions Tsld=260C, 10sec. (Pre treatment 30C,70%,168hrs.) Tsld=215 5C, 3sec. (Lead Solder) -40C ~ 100C 1min. (10sec.) 1min. (Pre treatment 30C,70%,168hrs.) -40C ~ 25C ~ 100C ~ 25C 30min. 5min. 30min. 5min. 25C ~ 65C ~ -10C 90%RH 24hrs./1cycle Ta=100C Ta=60C, RH=90% Ta=-40C Ta=25C, IF=30mA Ta=85C, IF=7.5mA 60C, RH=90%, IF=20mA Ta=-40C, IF=20mA JEITA ED-4701 500 501 JEITA ED-4701 400 403 JEITA ED-4701 300 304 Solvent : Isopropyl Alcohol Solvent Temperature : 20 ~ 25C Dipping Time : 5 min. 200m/s2, 100 ~ 2000Hz (Sweep 4min.) 48min., 3directions 75cm R=1.5k, C=100pF Test Voltage=2kV Note 2 times Number of Damaged 0/22 1 time over 95% 100 cycles 0/22 0/100 Temperature Cycle Moisture Resistance Cyclic High Temperature Storage Temperature Humidity Storage Low Temperature Storage Steady State Operating Life Steady State Operating Life of High Temperature Steady State Operating Life of High Humidity Heat Steady State Operating Life of Low Temperature Permanence of Marking 100 cycles 10 cycles 1000 hrs. 1000 hrs. 1000 hrs. 500 hrs. 500 hrs. 500 hrs. 1000 hrs. 1 time 0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/22 Vibration Drop Electrostatic Discharge 4 times 3 times 3 times Negative/Positive 0/10 0/10 0/22 (2) CRITERIA FOR JUDGING THE DAMAGE Criteria for Judgement Item Symbol Test Conditions Min. Max. Forward Voltage VF IF=20mA U.S.L.*)$ 1.1 Luminous Intensity IV IF=20mA L.S.L.**)$ 0.7 *) U.S.L. : Upper Standard Level **) L.S.L. : Lower Standard Level -3- Nichia STSE-CC3066A 7.CAUTIONS (1) Moisture Proof Package * When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. * The moisture proof package is made of an aluminum moisture proof bag with a zipper. A package of a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag. The silica gel changes its color from blue to pink as it absorbs moisture. (2) Storage * Storage Conditions Before opening the package : The LEDs should be kept at 30C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. * If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : more than 24 hours at 65 5C * Nichia LED electrode sections are comprised of a silver plated copper alloy. The silver surface may be affected by environments which contain corrosive gases and so on. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the User use the LEDs as soon as possible. * Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. (3) Heat Generation * Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. * The operating current should be decided after considering the ambient maximum temperature of LEDs. -4- Nichia STSE-CC3066A Pre-heat Pre-heat time Peak temperature Soldering time Condition Reflow Soldering Lead Solder Lead-free Solder 180 ~ 200C 120 ~ 150C 120 sec. Max. 120 sec. Max. 240C Max. 260C Max. 10 sec. Max. 10 sec. Max. refer to refer to Temperature - profile 1. Temperature - profile 2. (N2 reflow is recommended.) Hand Soldering Temperature Soldering time 350C Max. 3 sec. Max. (one time only) ! After reflow soldering rapid cooling should be avoided. [Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure. <1 : Lead Solder> 2.5 ~ 5C / sec. Pre-heating 120 ~ 150C 60sec.Max. Above 200C <2 : Lead-free Solder> 1~ 5C / sec. 240C Max. 10sec. Max. 1~ 5C / sec. Pre-heating 180 ~ 200C 60sec.Max. Above 220C 260C Max. 10sec. Max. 2.5 ~ 5C / sec. 120sec.Max. 120sec.Max. [Recommended soldering pad design] Use the following conditions shown in the figure. 2.9 0.8 2.9 2.0 (1.5) * Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. * Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. * Reflow soldering should not be done more than two times. * When soldering, do not put stress on the LEDs during heating. * After soldering, do not warp the circuit board. (5) Cleaning * It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. * Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. -5- (0.25) (Unit : mm) Nichia STSE-CC3066A -6- Nichia STSE-CC3066A ICI Chromaticity Diagram 0.9 520 530 0.8 540 510 0.7 550 560 0.6 570 500 0.5 580 590 y 0.4 600 610 620 630 0.3 490 0.2 480 0.1 W 470 460 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 x ! Color Coordinates Measurement allowance is 0.01. -7- ! Forward Voltage vs. Forward Current 200 Forward Current IFP (mA) 100 50 20 10 5 Ta=25C ! Forward Current vs. Relative Luminosity 3.5 Relative Luminosity (a.u.) 3.0 2.5 2.0 1.5 1.0 0.5 0 0 20 40 60 80 100 120 Forward Current IFP (mA) Ta=25C ! Duty Ratio vs. Allowable Forward Current Allowable Forward Current IFP (mA) 200 Ta=25C 100 50 30 20 10 1 1 2.5 3.0 3.5 4.0 4.5 5.0 Forward Voltage VF (V) 5 10 20 50 100 Duty Ratio (%) ! Ambient Temperature vs. Forward Voltage 5.8 ! Ambient Temperature vs. Relative Luminosity 2.0 Relative Luminosity (a.u.) IFP=20mA 1.0 ! Ambient Temperature vs. Allowable Forward Current Allowable Forward Current IF (mA) 40 30 20 10 0 Forward Voltage VF (V) -8- 5.4 5.0 4.6 4.2 3.8 3.4 3.0 IFP=60mA IFP=20mA IFP=5mA 0.5 2.6 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (C) 0.2 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (C) 0 20 40 60 80 100 Ambient Temperature Ta (C) Nichia STSE-CC3066A Model NSCB505C NICHIA CORPORATION Title No. TYP.CHARACTERISTICS 031021317871 ! Forward Current vs. Chromaticity Coordinate (D) 0.13 Ta=25C 0.11 0.09 1mA(473nm) 5mA(472nm) 20mA(470nm) 50mA(468nm) 100mA(467nm) ! Spectrum Relative Emission Intensity (a.u.) 1.2 1.0 0.8 0.6 0.4 0.2 0 350 400 450 500 550 600 650 Wavelength (nm) Ta=25C IF=20mA y 0.07 0.05 0.03 0.10 0.12 0.14 0.16 0.18 0.20 x ! Forward Current vs. Dominant Wavelength Dominant Wavelength D (nm) ! Ambient Temperature vs. Dominant Wavelength Dominant Wavelength D (nm) ! Directivity (NSCB505C) 1.0 0 Ta=25C IF=20mA X-X Y-Y 0.5 10 20 30 40 50 X Y X Y 474 473 472 471 470 469 468 467 466 1 5 10 20 50 100 Forward Current IFP (mA) Ta=25C 476 474 472 470 468 466 464 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (C) IFP=20mA Relative Luminosity (a.u.) -9- 60 70 80 0 90 60 30 Radiation Angle 0 0.5 90 1.0 Nichia STSE-CC3066A Model NSCB505C NICHIA CORPORATION Title No. TYP.CHARACTERISTICS 031021317881 4.2 Internal circuit A ITEM PACKAGE ENCAPSULATING RESIN ELECTRODES MATERIALS Heat-Resistant Polymer Epoxy Resin (with Diffused) Ag Plating Copper Alloy (0.7) 3 ! NSCB505C has a protection device built in as a protection circuit against static electricity. (1) Cathode mark (0.5) 4.5 (4) K Protection device LED (2.2) 0.63 1.25 2.65 2.5 3 1 1.8 -10- Nichia STSE-CC3066A Cathode 1.55 (1.2) 4.3 1.55 Anode Model NSCB505C Unit mm 10/1 Scale Allow 0.2 NICHIA CORPORATION Title No. OUTLINE DIMENSIONS 030826314371 Taping part 1.5+0.1 -0 80.1 20.1 40.1 1.750.1 0.30.05 Reel part 3300.2 17.51 13.50.5 Cathode mark 5.50.05 12+0.2 - 0.1 4.750.1 2 1 0.8 13 0.2 1.5+0.2 -0 3.250.1 3.350.1 Label XXXX LED Reel end of tape No LEDs TYPE NSCx505xT LOT XXXXXX-!! QTY pcs LEDs mounting part No LEDs 801 Pull direction Top cover tape -11Reel Lead Min.40mm (No LEDs) Reel Lead Min.320mm(No LEDs is more than 40) Reel Lead Min.400mm Embossed carrier tape Nichia STSE-CC3066A 2,500pcs/Reel Model Taping is based on the JIS C 0806 : Packaging of Electronic Components on Continuous Tapes. NSCx505xT Unit mm Scale Allow NICHIA CORPORATION Title No. TAPING DIMENSIONS 031021202553 Nichia STSE-CC3066A Moisture proof foil bag Reel Label NICHIA Seal XXXX LED TYPE LOT QTY NSCx505xT xxxxxx-!" PCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Moisture absorbent material Empty space in the box is filled with cushion material. Label NICHIA Nichia LED XXXX LED TYPE RANK QTY NSCx505xT !" PCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Packing unit Moisture proof foil bag Cardboard box Cardboard box S Cardboard box L Reel/bag 1reel Quantity/bag (pcs) 2,500 MAX. Reel/box 4reel MAX. Cardboard box S!3 12reel MAX. Quantity/box (pcs) 10,000 MAX. 30,000 MAX. Dimensions (mm) 380!380!135!4t 400!400!560!4t Model NSCx505xT NICHIA CORPORATION Title No. PACKING 031021202563 -12- |
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